Name：TITANIUMSILICIDE

Formula：Ti5si3

Cas：12067-57-1

Appearance：dark gray

MeltingPoint：2130℃

BoilingPoint：2130℃

Density：4.39g/cm3

molecularweight：323.59

Dangerous goods UN.：UN3178

Uses: Titanium silicide is widely used in the manufacture of gates, source/drain, interconnections and ohmic contacts for metal oxide semiconductors (MOS), metal oxide semiconductor field-effect transistors (MOSFETs) and dynamic random access memory (DRAM).

Performance and use of pentasilicide:

Ti5Si3 has a high melting point (2130℃), low density (4.65g/cm3) and excellent high temperature properties such as high temperature hardness, good high temperature stability, oxidation resistance, can be used for high temperature structural materials above 1300℃. The melting point of Ti5Si3 is close to or even higher than that of high-temperature structural ceramics, but its density is much lower than that of some high-temperature structural ceramics and superalloys, which is comparable to titanium alloys and has the potential to be used at high temperatures. In addition, due to its low resistance and thermal resistance, Ti5Si3 is also promising for electrical connection structures and diffusion barrier layers.