Chinese name: Tantalum nitride
English name: tantalum nitride
CAS number: 12033-62-4
Density: 13.4 g/cm3
Crystal type: black hexagonal crystal
Melting point: 3090°C
Chemical formula: NTa
Resistivity: 128μΩ· cm
Thermal conductivity: 9.54W/(m·K)
Molecular weight: 194.95500
Accurate mass: 194.95100
Microhardness: 1100kg/m2
Thermal conductivity: 9.54W/(m· K)
Lattice constant: a=0.4336nm, c=0.4150nm
Water soluble: insoluble in water, acid, slightly soluble in aqua regia, soluble in potassium hydroxide and decompose to release ammonia, heating to 2000℃ that is to release nitrogen.

Preparation method
1. Tantalum metal powder is directly nitrided with nitrogen or ammonia at about 1100℃.
2. Tantalum nitride is prepared with tantalum metal and nitrogen as raw materials, and the reaction formula is as follows: 2Ta+N2=2TaN
Tantalum metal powder is directly nitrided with nitrogen or ammonia at about 1100℃.
Function/use
1, the material used to make precise sheet resistance, tantalum nitride resistance can resist water vapor erosion. In the process of manufacturing integrated circuits, these films are deposited on top of silicon wafers to form thin film surface mount resistors. Tantalum nitride resistance, a material used to make sheet resistors, resists erosion by water vapor. Tantalum nitride material is used to make the protective layer of the chip wire.
2, used as a super hard material additive, can prepare pure tantalum pentachloride: for spraying, increase the electrical stability of transformers, integrated lines, diodes.
Packaging and storage: This product is packed in inert plastic bags, sealed and stored in dry and cool environment, should not be exposed to air, prevent moisture oxidation and agglomeration, affect the dispersion performance and use effect; The quantity of packaging can be provided according to customer's request, sub-packaging.